Thermoplastic resin composition, and molded article obtained by molding same

The thermoplastic resin composition comprises a semi-aromatic polyamide (A) and a polyphenylene ether (B), and is characterized in that the semi-aromatic polyamide (A) contains an aromatic dicarboxylic acid component and a diamine component, wherein the primary component of the aromatic dicarboxylic...

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MII JUNICHI
description The thermoplastic resin composition comprises a semi-aromatic polyamide (A) and a polyphenylene ether (B), and is characterized in that the semi-aromatic polyamide (A) contains an aromatic dicarboxylic acid component and a diamine component, wherein the primary component of the aromatic dicarboxylic acid component is terephthalic acid, and the primary component of the diamine component is 1,10-decanediamine, 1,11-undecanediamine, or 1,12-dodecanediamine; the molar ratio (A/B) between the semi-aromatic polyamide (A) and the polyphenylene ether (B) is 15/85 to 85/15; the melting point of the thermoplastic resin composition is 290 DEG C or above; and the difference between the melting point and the crystallization temperature of the thermoplastic resin composition is no more than 30 DEG C. 一种热塑性树脂组合物,其特征在于,含有半芳香族聚酰胺(A)和聚苯醚(B),半芳香族聚酰胺(A)含有芳香族二羧酸成分和二胺成分,芳香族二羧酸成分以对苯二甲酸为主成分,二胺成分以1,10-癸二胺、1,11-十一烷二胺或者1,12-十二烷二胺为主成分,半芳香族聚酰胺(A)与聚苯醚(B)的质量比(A/B)为15/85~85/15,热塑性树脂组合物的熔点为290℃以上,热塑性树脂组合物的熔点与结晶温度的差为30℃以下。
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN111712544A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN111712544A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN111712544A3</originalsourceid><addsrcrecordid>eNqNijEOwjAMALswIOAPZochUMSMKhADYupeuYkBS4kdxVn4PRXiAUwn3d28ufUvKklzRKvsoZCxgNeU1biyygZQAiSNgQJgmZ5IoGNFlkmM729ieYJhomUze2A0Wv24aNaXc99dt5R1IMvoSagO3d05d3S7Q9ue9v88H7z2NeQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Thermoplastic resin composition, and molded article obtained by molding same</title><source>esp@cenet</source><creator>SAIJO TAKEHITO ; MII JUNICHI</creator><creatorcontrib>SAIJO TAKEHITO ; MII JUNICHI</creatorcontrib><description>The thermoplastic resin composition comprises a semi-aromatic polyamide (A) and a polyphenylene ether (B), and is characterized in that the semi-aromatic polyamide (A) contains an aromatic dicarboxylic acid component and a diamine component, wherein the primary component of the aromatic dicarboxylic acid component is terephthalic acid, and the primary component of the diamine component is 1,10-decanediamine, 1,11-undecanediamine, or 1,12-dodecanediamine; the molar ratio (A/B) between the semi-aromatic polyamide (A) and the polyphenylene ether (B) is 15/85 to 85/15; the melting point of the thermoplastic resin composition is 290 DEG C or above; and the difference between the melting point and the crystallization temperature of the thermoplastic resin composition is no more than 30 DEG C. 一种热塑性树脂组合物,其特征在于,含有半芳香族聚酰胺(A)和聚苯醚(B),半芳香族聚酰胺(A)含有芳香族二羧酸成分和二胺成分,芳香族二羧酸成分以对苯二甲酸为主成分,二胺成分以1,10-癸二胺、1,11-十一烷二胺或者1,12-十二烷二胺为主成分,半芳香族聚酰胺(A)与聚苯醚(B)的质量比(A/B)为15/85~85/15,热塑性树脂组合物的熔点为290℃以上,热塑性树脂组合物的熔点与结晶温度的差为30℃以下。</description><language>chi ; eng</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200925&amp;DB=EPODOC&amp;CC=CN&amp;NR=111712544A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200925&amp;DB=EPODOC&amp;CC=CN&amp;NR=111712544A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAIJO TAKEHITO</creatorcontrib><creatorcontrib>MII JUNICHI</creatorcontrib><title>Thermoplastic resin composition, and molded article obtained by molding same</title><description>The thermoplastic resin composition comprises a semi-aromatic polyamide (A) and a polyphenylene ether (B), and is characterized in that the semi-aromatic polyamide (A) contains an aromatic dicarboxylic acid component and a diamine component, wherein the primary component of the aromatic dicarboxylic acid component is terephthalic acid, and the primary component of the diamine component is 1,10-decanediamine, 1,11-undecanediamine, or 1,12-dodecanediamine; the molar ratio (A/B) between the semi-aromatic polyamide (A) and the polyphenylene ether (B) is 15/85 to 85/15; the melting point of the thermoplastic resin composition is 290 DEG C or above; and the difference between the melting point and the crystallization temperature of the thermoplastic resin composition is no more than 30 DEG C. 一种热塑性树脂组合物,其特征在于,含有半芳香族聚酰胺(A)和聚苯醚(B),半芳香族聚酰胺(A)含有芳香族二羧酸成分和二胺成分,芳香族二羧酸成分以对苯二甲酸为主成分,二胺成分以1,10-癸二胺、1,11-十一烷二胺或者1,12-十二烷二胺为主成分,半芳香族聚酰胺(A)与聚苯醚(B)的质量比(A/B)为15/85~85/15,热塑性树脂组合物的熔点为290℃以上,热塑性树脂组合物的熔点与结晶温度的差为30℃以下。</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNijEOwjAMALswIOAPZochUMSMKhADYupeuYkBS4kdxVn4PRXiAUwn3d28ufUvKklzRKvsoZCxgNeU1biyygZQAiSNgQJgmZ5IoGNFlkmM729ieYJhomUze2A0Wv24aNaXc99dt5R1IMvoSagO3d05d3S7Q9ue9v88H7z2NeQ</recordid><startdate>20200925</startdate><enddate>20200925</enddate><creator>SAIJO TAKEHITO</creator><creator>MII JUNICHI</creator><scope>EVB</scope></search><sort><creationdate>20200925</creationdate><title>Thermoplastic resin composition, and molded article obtained by molding same</title><author>SAIJO TAKEHITO ; MII JUNICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111712544A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>SAIJO TAKEHITO</creatorcontrib><creatorcontrib>MII JUNICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAIJO TAKEHITO</au><au>MII JUNICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thermoplastic resin composition, and molded article obtained by molding same</title><date>2020-09-25</date><risdate>2020</risdate><abstract>The thermoplastic resin composition comprises a semi-aromatic polyamide (A) and a polyphenylene ether (B), and is characterized in that the semi-aromatic polyamide (A) contains an aromatic dicarboxylic acid component and a diamine component, wherein the primary component of the aromatic dicarboxylic acid component is terephthalic acid, and the primary component of the diamine component is 1,10-decanediamine, 1,11-undecanediamine, or 1,12-dodecanediamine; the molar ratio (A/B) between the semi-aromatic polyamide (A) and the polyphenylene ether (B) is 15/85 to 85/15; the melting point of the thermoplastic resin composition is 290 DEG C or above; and the difference between the melting point and the crystallization temperature of the thermoplastic resin composition is no more than 30 DEG C. 一种热塑性树脂组合物,其特征在于,含有半芳香族聚酰胺(A)和聚苯醚(B),半芳香族聚酰胺(A)含有芳香族二羧酸成分和二胺成分,芳香族二羧酸成分以对苯二甲酸为主成分,二胺成分以1,10-癸二胺、1,11-十一烷二胺或者1,12-十二烷二胺为主成分,半芳香族聚酰胺(A)与聚苯醚(B)的质量比(A/B)为15/85~85/15,热塑性树脂组合物的熔点为290℃以上,热塑性树脂组合物的熔点与结晶温度的差为30℃以下。</abstract><oa>free_for_read</oa></addata></record>
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subjects CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
title Thermoplastic resin composition, and molded article obtained by molding same
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