Thermoplastic resin composition, and molded article obtained by molding same

The thermoplastic resin composition comprises a semi-aromatic polyamide (A) and a polyphenylene ether (B), and is characterized in that the semi-aromatic polyamide (A) contains an aromatic dicarboxylic acid component and a diamine component, wherein the primary component of the aromatic dicarboxylic...

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Hauptverfasser: SAIJO TAKEHITO, MII JUNICHI
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The thermoplastic resin composition comprises a semi-aromatic polyamide (A) and a polyphenylene ether (B), and is characterized in that the semi-aromatic polyamide (A) contains an aromatic dicarboxylic acid component and a diamine component, wherein the primary component of the aromatic dicarboxylic acid component is terephthalic acid, and the primary component of the diamine component is 1,10-decanediamine, 1,11-undecanediamine, or 1,12-dodecanediamine; the molar ratio (A/B) between the semi-aromatic polyamide (A) and the polyphenylene ether (B) is 15/85 to 85/15; the melting point of the thermoplastic resin composition is 290 DEG C or above; and the difference between the melting point and the crystallization temperature of the thermoplastic resin composition is no more than 30 DEG C. 一种热塑性树脂组合物,其特征在于,含有半芳香族聚酰胺(A)和聚苯醚(B),半芳香族聚酰胺(A)含有芳香族二羧酸成分和二胺成分,芳香族二羧酸成分以对苯二甲酸为主成分,二胺成分以1,10-癸二胺、1,11-十一烷二胺或者1,12-十二烷二胺为主成分,半芳香族聚酰胺(A)与聚苯醚(B)的质量比(A/B)为15/85~85/15,热塑性树脂组合物的熔点为290℃以上,热塑性树脂组合物的熔点与结晶温度的差为30℃以下。