Curable resin composition, dry film, cured product, and electronic component

The invention relates to a curable resin composition, a dry film, a cured product, and an electronic component. Provided are: a curable resin composition which exhibits excellent adhesion to a copperfoil and excellent resolution despite a large amount of an inorganic filler; and the like. The curabl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM DAERIM, ITO NOBUHITO, OKAYASU KATSUKI, YODA TAKESHI
Format: Patent
Sprache:chi ; eng
Schlagworte:
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