Curable resin composition, dry film, cured product, and electronic component

The invention relates to a curable resin composition, a dry film, a cured product, and an electronic component. Provided are: a curable resin composition which exhibits excellent adhesion to a copperfoil and excellent resolution despite a large amount of an inorganic filler; and the like. The curable resin composition is characterized by comprising: (A) an alkali-soluble resin having an ethylenically unsaturated group, (B) a photopolymerization initiator, (C) an epoxy resin, and (D) an inorganic filler, wherein the blending amount of the inorganic filler (D) is 50 mass% or more in terms of solid content, and substantially no organic compound having an ethylenically unsaturated group is contained in addition to the alkali-soluble resin (A) having an ethylenically unsaturated group, and theepoxy resin (C) comprises: (C-1) a liquid epoxy resin that is liquid at 20 DEG C; (C-2) a semisolid epoxy resin which is solid at 20 DEG C and is liquid at 40 DEG C; and (C-3) a solid epoxy resin that is solid at 40 DEG C. 本发