Lead Frame Stabilizer for Improved Lead Planarity

A packaged semiconductor device includes: a die paddle; a semiconductor die mounted on the die paddle; a plurality of fused leads extending away from a first side of the die paddle; a discrete lead that extends away from the first side of the die paddle and is physically detached from the plurality of fused leads; a first electrical connection between a first terminal of the semiconductor die andthe discrete lead, an encapsulation material that encapsulates the semiconductor die; and a stabilizer bar connected to a first outer edge side of the discrete lead. The first outer edge side of the discrete lead is opposite from a second outer edge side of the discrete lead which faces the plurality of fused leads. 一种封装的半导体器件，包括：管芯焊盘；半导体管芯，安装在所述管芯焊盘上；多个熔融引线，远离所述管芯焊盘的第一侧延伸；分立引线，所述分立引线远离所述管芯焊盘的所述第一侧延伸并且与所述多个熔融引线物理上分离；第一电连接，在所述半导体管芯的第一端子与所述分立引线之间；包封材料，所述包封材料包封所述半导体管芯；以及稳定杆，连接到所述分立引线的第一外边缘侧。所述分立引线的所述第一外边缘侧与所述分立引线的面对所述多个熔融引线的第二外边缘侧相对。