Panel abutting method and device by internal high pressure forming

The invention provides a panel abutting device by internal high pressure forming. The device comprises a die, a panel layer and a punch, wherein a split die is arranged above the die; the panel layeris placed right above the die; and the punch is located right above the panel layer. The invention further provides a method of abutting the panel formed by the internal high pressure. The method specifically comprises the following steps of starting a panel abutting device by internal high pressure forming; injecting a high pressure liquid after the punch is in contact with an upper auxiliary panel; and carrying out extrusion deformation on the panel layer and cutting the panel to a round waste to form a mechanical lock. The device and method can abut same or different panels without damaginga coating on the surface of a material, and no smog, sparks and harmful gas in the panel abutting process are generated, so that the working environment can be improved. The formed mechanical lock ishigh in strength and can b