SEMICONDUCTOR DEVICE

This semiconductor device comprises: a semiconductor substrate; a first groove that is provided in the semiconductor substrate, has a first width W1, and extends in a first direction; and a second groove that is provided in the semiconductor substrate in communication with the first groove, has a se...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KANEGUCHI TOKIHISA
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!