SEMICONDUCTOR DEVICE
This semiconductor device comprises: a semiconductor substrate; a first groove that is provided in the semiconductor substrate, has a first width W1, and extends in a first direction; and a second groove that is provided in the semiconductor substrate in communication with the first groove, has a se...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | This semiconductor device comprises: a semiconductor substrate; a first groove that is provided in the semiconductor substrate, has a first width W1, and extends in a first direction; and a second groove that is provided in the semiconductor substrate in communication with the first groove, has a second width W2 different from the first width, and extends in a second direction intersecting the first direction. Either the first groove or the second groove is used for alignment.
该半导体装置包括:半导体基板;第一凹槽,设置在半导体基板中,具有第一宽度W1并在第一方向上延伸;以及第二凹槽,设置在半导体基板中,与第一凹槽连通,具有不同于第一宽度的第二宽度W2,并且在与第一方向相交的第二方向上延伸。第一凹槽和所述第二凹槽中的一个用于对准。 |
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