A MEASUREMENT APPARATUS AND A METHOD FOR DETERMINING A SUBSTRATE GRID

A measurement apparatus (10) and method for determining a substrate grid describing a deformation of a substrate (12) prior to exposure of the substrate (12) in a lithographic apparatus (LA) configured to fabricate one or more features on the substrate (12). Position data for a plurality of first features and/or a plurality of second features on the substrate (12) is obtained. Asymmetry data for at least a feature of the plurality of first features and/or the plurality of second features is obtained. The substrate grid based on the position data and the asymmetry data is determined. The substrate grid and asymmetry data are passed to the lithographic apparatus LA for controlling at least part of an exposure process to fabricate one or more features on the substrate (12). 一种确定衬底栅格的测量设备(10)和方法，衬底栅格描述了光刻设备(LA)中曝光衬底(12)之前衬底(12)的变形，光刻设备(LA)配置成在衬底(12)上制造一个或多个特征。获取在衬底(12)上多个第一特征和/或多个第二特征的位置数据。获取所述多个第一特征和/或所述多个第二特征中的至少一个特征的不对称性数据。基于位置数据和不对称性数据确定衬底栅格。将衬底栅格和不对称性数据传递到所述光刻设备LA，用于控制曝光过程的至少一部分以在衬底(12)上制造一个或多个特征。