Flux and solder paste

Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt% of a (2-carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt% of arosin, and furthermore contains a solvent. The (2-carboxyalkyl)isocyanurate adduct is a mono(2-carbox...

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Bibliographische Detailangaben
Hauptverfasser:	MIYAGI NANAKO, TAKAKI AKIKO, HASHIMOTO YUTAKA, MINEGISHI KAZUHIRO, TSUDA RYUICHI, KAWASAKI HIROYOSHI, KITAZAWA KAZUYA, TAKAGI KAZUYORI, OTSUKI TEPPEI, HORIKOSHI RINA, NAGAI TOMOKO, SHIRATORI MASATO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt% of a (2-carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt% of arosin, and furthermore contains a solvent. The (2-carboxyalkyl)isocyanurate adduct is a mono(2-carboxyalkyl)isocyanurate adduct, a bis(2-carboxyalkyl)isocyanurate adduct, a tris(2-carboxyalkyl)isocyanurate adduct, or a combination of two or more of these. 本发明提供一种使软钎料的润湿性提高的助焊剂和使用该助焊剂的焊膏。所述助焊剂含有0.5wt％以上其20.0wt％以下的(2-羧基烷基)异氰脲酸酯加成物、5.0wt％以上且45.0wt％以下的松香，并且还含有溶剂。(2-羧基烷基)异氰脲酸酯加成物为单(2-羧基烷基)异氰脲酸酯加成物、双(2-羧基烷基)异氰脲酸酯加成物和三(2-羧基烷基)异氰脲酸酯加成物中的任意一种或两种以上的组合。