High-heat-flux porous heat sink flow cooling device

The invention discloses a high-heat-flux porous heat sink flow cooling device, and aims to provide an electronic equipment cooling device which is large in heat exchange amount, high in heat exchangeefficiency and high in heat exchange mode reliability. According to the technical scheme, two-way jet flow steam channels in a porous array are formed in the inner wall faces of the bottom layers of atrunk road type porous flat plate heat sink and a steam cavity base; and the liquid working medium in the steam cavity flows to a gas/liquid interface formed by an arterial road type porous flat plate heat sink under the capillary pressure of the heat source capillary tube core and by means of high-pressure gas, is heated and evaporated to perform jet injection and flow to a liquid inlet substrate, is transmitted to the pipe wall of a condensation cavity of the array matrix condensation pipe group, and is flown back into the steam cavity to form a working medium for circularly flowing and absorbing heat in a sealed ar