Method for determining optimal scribing direction of single crystal wafer

The invention discloses a method for determining the optimal scribing direction of a single crystal wafer. The method comprises the following steps of: randomly selecting a forward test strip and a reverse test strip on the surface of a single crystal wafer sample, then respectively carrying out scratching test along the forward test strip and the reverse test strip on the surface of the single crystal wafer by using an abrasive material, and making the scratching directions of the forward test strip and the reverse test strip opposite to obtain the single crystal wafer sample scratched alongtwo opposite directions, detecting the surface topography of two scratches on the surface of the single crystal wafer sample through detection equipment, finally observing the crack forms of the surfaces of the two scratches and the width of an influence region, and determining the scratching direction with relatively small width of the crack influence region as the optimal scribing direction. Themethod can be used for di