SEMICONDUCTOR COMPONENT AND SEMICONDUCTOR PACKAGE

In an embodiment, a semiconductor package is provided that comprises at least one die pad, a plurality of outer contacts, a first semiconductor device and a second semiconductor device. The second semiconductor device comprises a first transistor device having a source electrode, a gate electrode and a drain electrode, a front surface and a rear surface. A front metallization is positioned on thefront surface and a rear metallization on the rear surface of the second semiconductor device. The front metallization comprises a first power contact pad coupled to the source electrode, the first power contact pad being mounted on the die pad. The rear metallization comprises a second power contact pad electrically coupled to the drain electrode and an auxiliary lateral redistribution structurethat is electrically insulated from the second power contact pad and the drain electrode. The first semiconductor device is electrically coupled to the auxiliary lateral redistribution structure. 在一个实施例中，提供了一种半导体封装，其包括至少一个管芯垫、