Internal plating equipment suitable for pipes

The invention discloses internal plating equipment suitable for pipes. The internal plating equipment suitable for the pipes comprises an electroplating operation platform, wherein the electroplatingoperation platform comprises a cleaning water tank, a first circulating pump, a first electromagnetic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: XIA LEI, ZHANG YUFENG, MENG XIANGYU, LIN SHIGAO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses internal plating equipment suitable for pipes. The internal plating equipment suitable for the pipes comprises an electroplating operation platform, wherein the electroplatingoperation platform comprises a cleaning water tank, a first circulating pump, a first electromagnetic switch valve, a manual regulating valve, a pipe fitting assembly, an anode, a second electromagnetic switch valve, a plating tank, a second circulating pump, a third electromagnetic switch valve, a fourth electromagnetic switch valve, a fifth electromagnetic switch valve, a power supply anode anda power supply cathode, wherein the first circulating pump is connected with the cleaning water tank, and the first electromagnetic switch valve is located at the water outlet end of the first circulating pump. The internal plating equipment suitable for the pipes is reasonable in structural design, the design of the electroplating operation platform changes a traditional equipment form, a large number of electroplating ta