A packaging mold and a packaging method

A packaging mold comprises a mold body, two first cavities and a plurality of second cavities. The mold body is provided with at least one mold sealing area. The two first cavities are connected withthe mold body, each first cavity is provided with a containing cavity and at least one connecting cha...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZENG YIXIU, JIAN ZIJIE, CHEN XIHONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!