A packaging mold and a packaging method

A packaging mold comprises a mold body, two first cavities and a plurality of second cavities. The mold body is provided with at least one mold sealing area. The two first cavities are connected withthe mold body, each first cavity is provided with a containing cavity and at least one connecting cha...

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Bibliographische Detailangaben
Hauptverfasser: ZENG YIXIU, JIAN ZIJIE, CHEN XIHONG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:A packaging mold comprises a mold body, two first cavities and a plurality of second cavities. The mold body is provided with at least one mold sealing area. The two first cavities are connected withthe mold body, each first cavity is provided with a containing cavity and at least one connecting channel, and the connecting channels are communicated with the mold sealing area and the containing cavities. The second cavities are connected with the mold body, each second cavity is provided with a material containing cavity and at least one feeding pouring channel, and the feeding pouring channels communicate with the mold sealing area and the material containing cavities. The volume of the connecting channel of the first cavity is larger than or equal to the volume of the feeding pouring channel of the second cavity. 一种封装模具包括模具本体、两个第一腔体及多个第二腔体。所述模具本体具有至少一个模封区。所述两个第一腔体连接所述模具本体,每一所述第一腔体具有容置腔及至少一个连接通道,且所述连接通道连通所述模封区及所述容置腔。所述第二腔体连接所述模具本体,每一所述第二腔体具有置料腔及至少一个加料浇注通道,且所述加料浇注通道连通所述模封区及所述置料腔。所述第一腔体的所述连接通道的容积大于或等于所述第二腔体的所述加