Multi-cavity combined type pre-packaging structure and method

The invention discloses a multi-cavity combined type pre-packaging structure and method. The multi-cavity combined type pre-packaging structure comprises a plate, a plurality of pre-packaging tube shells are arranged on the plate, each pre-packaging tube shell comprises a carrier plate, a plurality of spacing plates are arranged at the top of the carrier plate, and a tube shell unit with a cavityis defined by the plurality of spacing plates. According to the structure, the plurality of pre-packaged tube shells are arranged on the plate block, and the plate block can be cut according to the number and the shape of chips to be packaged in actual use, so that the structure can be suitable for manufacturing tube shells with different sizes and different styles. 本发明公开了一种多腔体组合式预封装结构及方法，包括板块，所述板块上设置多个预封装管壳，每一所述预封装管壳包括载板，载板顶部设置多个间隔板，多个间隔板围成具有腔体的管壳单元。该结构在板块上设置多个预封装管壳，在实际使用时，可以根据需求封装芯片的数量以及形状对板块进行切割，进而可以适用于制作不同尺寸不同样式的管壳。