Method for polishing end surface of wafer without cleavage surface

The invention discloses a method for polishing an end surface of a wafer without a cleavage surface. The method is adopted to polish the end surface of the wafer without the cleavage surface by adopting a method of combining two-step grinding with two-step polishing, wherein the two-step grinding comprises coarse grinding and fine grinding, and the two-step grinding uses abrasive paper as an abrasive material, that is, the method provided by the invention can control the grinding direction and the grinding degree and prevent abrasive particles from being embedded in the end surface to be ground or scratching the end surface to be ground, and the rough polishing step is arranged before the fine polishing step so as to form two-step polishing, so that the polishing efficiency can be improved, the fine polishing time can be shortened by 33% or even more than 50%, the polishing efficiency is improved, the roughness of the end surface of the obtained wafer without the cleavage surface is less than 3 nm, and the re