Optical sensing chip packaging structure

The invention provides an optical sensing chip packaging structure, which comprises a substrate, a light sensing element, a light emitting element and a transparent cover plate, wherein the substrateis provided with a concave part, the light sensing element is arranged in the concave part and electrically connected with the substrate, the light emitting element is arranged in the concave part andelectrically connected with the substrate or the light sensing element, and the transparent cover plate is arranged on the substrate and covers the light sensing element and the light emitting element. 一种光学感测芯片封装结构，包括基板、光感测元件、发光元件以及透明盖板。基板具有凹部，光感测元件设置于凹部内，且与基板电性连接。发光元件设置于凹部内，且与基板或光感测元件电性连接。透明盖板设置于基板上，且覆盖光感测元件及发光元件。