Embossing method for embossing microstructures or nanostructures

The invention relates to a method for embossing structures with dimensions in the micrometer or nanometer range in a layer of varnish (6). The layer of varnish (6) is applied to one side of a film web(5) and can be hardened by means of ultraviolet radiation. The film web (5) is located in the conveying direction initially on one side, on which the layer of varnish which is yet to harden is applied, pressed through a presser (2) on an embossing cylinder (1) on which surface the structures which are to be stamped in the micrometer or nanometer region are arranged. This forms the structures in the micrometer range or in the nanometer range in the layer of varnish. Subsequently, the layer of varnish (6) is hardened by ultraviolet radiation of a source for ultraviolet radiation. According to the invention, the film web (5) is guided to the embossing cylinder (1) from above or at least obliquely from above. 本发明涉及一种用于将具有在微米或者纳米范围内尺寸的结构压印到由漆构成的漆层(6)中的方法，其中，该漆层(6)被设置在薄膜幅面(5)的一侧上并且能借助紫外辐射硬化。首先，将薄膜幅面(5)以其上存在还未被硬化的漆层的那侧沿