Electronic component welding method

The invention discloses an electronic component welding method. The method comprises the following steps that, preprocessing step, specifically, a PCB board is placed in a carrier, wherein the carrieris used for isolating the PCB board from a heat source, a plug-in component is arranged on the PCB board in a penetrating mode, and solder is coated in the contact between the plug-in component and the PCB board; heating step, specifically, the carrier is heated, and the carrier conducts heat to the PCB board to melt the solder in the gap between the plug-in component and the PCB board; cooling step, specifically, cooling treatment is carried out on the PCB board and the solder; and pre-heating step prior to the heating step, specifically, the carrier is heated until the preheating ready temperature is reached. According to the method, since the PCB board is completely or locally contained in the carrier, the heating source conducts heat to the PCB board through the carrier, the PCB boarddoes not directly approac