Process for improving ink in high aspect ratio Via hole

The invention belongs to the technical field of circuit board manufacturing, and discloses a process for improving ink in a high aspect ratio Via hole, which comprises the following steps: designing ablocking point on a screen printing plate, manufacturing the screen printing plate, carrying out solder mask pretreatment, carrying out solder mask exposure, and carrying out solder mask development.The process is simple to operate and simple in process; the solder mask printing blocking points on the screen printing plate can be changed at will according to patterns on a printed product and aredesigned into irregular blocking points, poor ink in holes is improved by reducing the amount of ink entering the holes in the silk-screen printing process, and scrapping and reworking of the ink inthe Via holes with the high aspect ratio are greatly reduced. 本发明属于线路板制造技术领域，公开了一种用于改善高纵横比Via孔孔内油墨的工艺，包括以下步骤：网版上挡点设计、网版制作、防焊前处理、防焊曝光、防焊显影。本发明操作简单，流程简捷；网版上的防焊印刷挡点可根据印刷制品上的图形随意变化，设计成不规则挡点，通过丝网印刷过程中减少油墨入孔量，来改善孔内油墨不良，大大降低高纵横比Via孔孔内油