Packaging process of salient point type bridging power device

The invention discloses a packaging process of a salient point type bridging power device. The method sequentially comprises the following steps: A, placing a chip: placing the chip; placing the chipto be processed on the chip mounting base, and then obtaining a first to-be-packaged body; B, arranging a bridging piece; and enabling the salient point type welding head of the bridging piece to be attached to the source region of the upper surface of the chip; C, welding the chip; enabling the chip to be electrically connected with the chip mounting base; enabling the source region of the chip to be connected with the first pin through a bridging piece, and then enabling the source S to be electrically connected with the first pin; enabling a grid G of the chip to be connected with the thirdpin 20 through a lead, and then enabling the grid G to be electrically connected with the third pin; and D, packaging a finished product: carrying out injection molding and packaging on the chip, thechip mounting base, the pi