Sensor protection packaging structure and method

The invention discloses a sensor protection packaging structure and method. The sensor protection packaging structure comprises a sensor packaging cavity upper shell and a sensor packaging cavity bottom shell which are assembled into a cavity, a through hole communicated with the interior of the cav...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAN ZHITONG, WANG JING, LIU YONGSHENG, WANG SHANGPING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING PHYSICS PRINTED CIRCUITS TESTING
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