Sensor protection packaging structure and method

The invention discloses a sensor protection packaging structure and method. The sensor protection packaging structure comprises a sensor packaging cavity upper shell and a sensor packaging cavity bottom shell which are assembled into a cavity, a through hole communicated with the interior of the cav...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YAN ZHITONG, WANG JING, LIU YONGSHENG, WANG SHANGPING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING PHYSICS PRINTED CIRCUITS TESTING
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Beschreibung
Zusammenfassung:	The invention discloses a sensor protection packaging structure and method. The sensor protection packaging structure comprises a sensor packaging cavity upper shell and a sensor packaging cavity bottom shell which are assembled into a cavity, a through hole communicated with the interior of the cavity is formed in the left end of the sensor packaging cavity bottom shell; a variable-diameter elastic element is arranged in the sensor packaging cavity bottom shell; the left end outer diameter of the elastic element is smaller than the right end outer diameter; the left end of the elastic elementis in interference fit with the through hole, a containing groove is formed in the right end of the elastic element, an inner hole communicated with the containing groove is formed in the left end ofthe elastic element, an installation groove is formed in the containing groove, a sensor, a sensor circuit board and a wire which are welded together are arranged in the cavity, and the sensor circuit board is clamped in the