Semiconductor device

The invention aims to solve the problem that a heat dissipation plate that is arranged on a semiconductor chip and a substrate is peeled from the bonding part of the substrate due to the stress of thermal expansion or thermal contraction. A semiconductor device has: a substrate of which a surface is an insulating material; a semiconductor chip flip-chip-connected onto the substrate; and a heat dissipation plate which is bonded to the semiconductor chip through a thermal interface material and is fixed to the substrate in the outside of the semiconductor chip. The heat dissipation plate has a projection which is bonded to the substrate by a conductive resin projecting to the substrate between a portion bonded to the semiconductor chip and a portion fixed to the substrate. The heat dissipation plate has a stress absorbing portion. Through the technical scheme, the situation that a heat dissipation plate that is arranged on a semiconductor chip and a substrate is peeled from the bonding part of the substrate due