Negative photosensitive resin composition and application thereof
The invention relates to a negative photosensitive resin composition. The negative photosensitive resin composition comprises (A) 10 to 50 weight percent of a polysiloxane compound which is prepared by polymerizing a plurality of monomers, wherein the monomers comprise siloxane monomers shown as the...
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| creator | LIN FANSEN ZHANG GUIJIA LAN DAJUN ZHANG ZHIYI XU RUOBEI |
| description | The invention relates to a negative photosensitive resin composition. The negative photosensitive resin composition comprises (A) 10 to 50 weight percent of a polysiloxane compound which is prepared by polymerizing a plurality of monomers, wherein the monomers comprise siloxane monomers shown as the following formulas (a-1), (a-2) and (a-3), and the siloxane monomers shown as the formulas (a-3) account for 10 mol% to 50 mol% of the total mole number of the polysiloxane compound. The negative photosensitive resin composition further comprises (B) 0.1 wt% to 30 wt% of a silicate ester oligomer,(C) 0.1 wt% to 10 wt% of a photoacid generator, and (D) the balance of solvent. R1, R2, R3, R4 and R5 are as defined in the specification. In addition, the invention further relates to an applicationof the negative photosensitive resin composition.
一种负型感光性树脂组合物，包括：(A)10重量百分比至50重量百分比的聚硅氧烷化合物，其由多种单体聚合而成，其中，这些单体包括如下式(a-1)、(a-2)及(a-3)所示的硅氧烷单体，且(a-3)所示的硅氧烷单体占聚硅氧烷化合物的总摩尔数的10mol％至50mol％；(B)0.1重量百分比至30重量百分比的硅酸酯寡聚物；(C)0.1重量百分比至10重 |
| format | Patent |
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一种负型感光性树脂组合物，包括：(A)10重量百分比至50重量百分比的聚硅氧烷化合物，其由多种单体聚合而成，其中，这些单体包括如下式(a-1)、(a-2)及(a-3)所示的硅氧烷单体，且(a-3)所示的硅氧烷单体占聚硅氧烷化合物的总摩尔数的10mol％至50mol％；(B)0.1重量百分比至30重量百分比的硅酸酯寡聚物；(C)0.1重量百分比至10重</description><language>chi ; eng</language><subject>ADVERTISING ; APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; CRYPTOGRAPHY ; DISPLAY ; DISPLAYING ; EDUCATION ; ELECTROGRAPHY ; HOLOGRAPHY ; LABELS OR NAME-PLATES ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEALS ; SIGNS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200724&DB=EPODOC&CC=CN&NR=111443574A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200724&DB=EPODOC&CC=CN&NR=111443574A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIN FANSEN</creatorcontrib><creatorcontrib>ZHANG GUIJIA</creatorcontrib><creatorcontrib>LAN DAJUN</creatorcontrib><creatorcontrib>ZHANG ZHIYI</creatorcontrib><creatorcontrib>XU RUOBEI</creatorcontrib><title>Negative photosensitive resin composition and application thereof</title><description>The invention relates to a negative photosensitive resin composition. The negative photosensitive resin composition comprises (A) 10 to 50 weight percent of a polysiloxane compound which is prepared by polymerizing a plurality of monomers, wherein the monomers comprise siloxane monomers shown as the following formulas (a-1), (a-2) and (a-3), and the siloxane monomers shown as the formulas (a-3) account for 10 mol% to 50 mol% of the total mole number of the polysiloxane compound. The negative photosensitive resin composition further comprises (B) 0.1 wt% to 30 wt% of a silicate ester oligomer,(C) 0.1 wt% to 10 wt% of a photoacid generator, and (D) the balance of solvent. R1, R2, R3, R4 and R5 are as defined in the specification. In addition, the invention further relates to an applicationof the negative photosensitive resin composition.
一种负型感光性树脂组合物，包括：(A)10重量百分比至50重量百分比的聚硅氧烷化合物，其由多种单体聚合而成，其中，这些单体包括如下式(a-1)、(a-2)及(a-3)所示的硅氧烷单体，且(a-3)所示的硅氧烷单体占聚硅氧烷化合物的总摩尔数的10mol％至50mol％；(B)0.1重量百分比至30重量百分比的硅酸酯寡聚物；(C)0.1重量百分比至10重</description><subject>ADVERTISING</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CRYPTOGRAPHY</subject><subject>DISPLAY</subject><subject>DISPLAYING</subject><subject>EDUCATION</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>LABELS OR NAME-PLATES</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEALS</subject><subject>SIGNS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD0S01PLMksS1UoyMgvyS9OzSvOBHOLUosz8xSS83ML8kEi-XkKiXkpCokFBTmZyYlgfklGalFqfhoPA2taYk5xKi-U5mZQdHMNcfbQTS3Ij08tLkhMTs1LLYl39jM0NDQxMTY1N3E0JkYNAH_2MqQ</recordid><startdate>20200724</startdate><enddate>20200724</enddate><creator>LIN FANSEN</creator><creator>ZHANG GUIJIA</creator><creator>LAN DAJUN</creator><creator>ZHANG ZHIYI</creator><creator>XU RUOBEI</creator><scope>EVB</scope></search><sort><creationdate>20200724</creationdate><title>Negative photosensitive resin composition and application thereof</title><author>LIN FANSEN ; ZHANG GUIJIA ; LAN DAJUN ; ZHANG ZHIYI ; XU RUOBEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111443574A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>ADVERTISING</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CRYPTOGRAPHY</topic><topic>DISPLAY</topic><topic>DISPLAYING</topic><topic>EDUCATION</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>LABELS OR NAME-PLATES</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEALS</topic><topic>SIGNS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>LIN FANSEN</creatorcontrib><creatorcontrib>ZHANG GUIJIA</creatorcontrib><creatorcontrib>LAN DAJUN</creatorcontrib><creatorcontrib>ZHANG ZHIYI</creatorcontrib><creatorcontrib>XU RUOBEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIN FANSEN</au><au>ZHANG GUIJIA</au><au>LAN DAJUN</au><au>ZHANG ZHIYI</au><au>XU RUOBEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Negative photosensitive resin composition and application thereof</title><date>2020-07-24</date><risdate>2020</risdate><abstract>The invention relates to a negative photosensitive resin composition. The negative photosensitive resin composition comprises (A) 10 to 50 weight percent of a polysiloxane compound which is prepared by polymerizing a plurality of monomers, wherein the monomers comprise siloxane monomers shown as the following formulas (a-1), (a-2) and (a-3), and the siloxane monomers shown as the formulas (a-3) account for 10 mol% to 50 mol% of the total mole number of the polysiloxane compound. The negative photosensitive resin composition further comprises (B) 0.1 wt% to 30 wt% of a silicate ester oligomer,(C) 0.1 wt% to 10 wt% of a photoacid generator, and (D) the balance of solvent. R1, R2, R3, R4 and R5 are as defined in the specification. In addition, the invention further relates to an applicationof the negative photosensitive resin composition.
一种负型感光性树脂组合物，包括：(A)10重量百分比至50重量百分比的聚硅氧烷化合物，其由多种单体聚合而成，其中，这些单体包括如下式(a-1)、(a-2)及(a-3)所示的硅氧烷单体，且(a-3)所示的硅氧烷单体占聚硅氧烷化合物的总摩尔数的10mol％至50mol％；(B)0.1重量百分比至30重量百分比的硅酸酯寡聚物；(C)0.1重量百分比至10重</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADVERTISING APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON CRYPTOGRAPHY DISPLAY DISPLAYING EDUCATION ELECTROGRAPHY HOLOGRAPHY LABELS OR NAME-PLATES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEALS SIGNS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | Negative photosensitive resin composition and application thereof |
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