Negative photosensitive resin composition and application thereof

The invention relates to a negative photosensitive resin composition. The negative photosensitive resin composition comprises (A) 10 to 50 weight percent of a polysiloxane compound which is prepared by polymerizing a plurality of monomers, wherein the monomers comprise siloxane monomers shown as the following formulas (a-1), (a-2) and (a-3), and the siloxane monomers shown as the formulas (a-3) account for 10 mol% to 50 mol% of the total mole number of the polysiloxane compound. The negative photosensitive resin composition further comprises (B) 0.1 wt% to 30 wt% of a silicate ester oligomer,(C) 0.1 wt% to 10 wt% of a photoacid generator, and (D) the balance of solvent. R1, R2, R3, R4 and R5 are as defined in the specification. In addition, the invention further relates to an applicationof the negative photosensitive resin composition. 一种负型感光性树脂组合物，包括：(A)10重量百分比至50重量百分比的聚硅氧烷化合物，其由多种单体聚合而成，其中，这些单体包括如下式(a-1)、(a-2)及(a-3)所示的硅氧烷单体，且(a-3)所示的硅氧烷单体占聚硅氧烷化合物的总摩尔数的10mol％至50mol％；(B)0.1重量百分比至30重量百分比的硅酸酯寡聚物；(C)0.1重量百分比至10重