METHOD FOR BONDING CYCLOOLEFIN POLYMER TO METAL, METHOD FOR MANUFACTURING BIOSENSOR, AND BIOSENSOR

A method for bonding a first member (cover plate), having a first bonding surface formed from a cycloolefin polymer, to a second member (electrode plate), having a second bonding surface formed from ametal, the method comprising a step for exposing the first bonding surface and the second bonding su...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	FUNAHASHI RISA, HASHIMOTO TAICHI, TERAI HIROKAZU, MIYAKE FUMINA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MACHINE TOOLS MEASURING METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SOLDERING OR UNSOLDERING TESTING TRANSPORTING WELDING WORKING BY LASER BEAM WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method for bonding a first member (cover plate), having a first bonding surface formed from a cycloolefin polymer, to a second member (electrode plate), having a second bonding surface formed from ametal, the method comprising a step for exposing the first bonding surface and the second bonding surface to H2O plasma and/or O2 plasma (step S21), and a step for aligning the first bonding surfaceand the second bonding surface (step S22). 本发明提供一种将第1构件(覆盖板)与第2构件(电极板)接合的方法，上述第1构件(覆盖板)具有由环烯烃聚合物形成的第1被接合面，上述第2构件(电极板)具有由金属形成的第2被接合面，且具备以下步骤：将第1被接合面及第2被接合面暴露于HO电浆及O电浆中的至少一者(步骤S21)；及合并第1被接合面与第2被接合面(步骤S22)。