SMT chip mounting process

The invention discloses a surface mount technology (SMT). The invention relates to the technical field of SMT patches, the method comprises the steps of screen printing, dispensing, patching, curing,reflow soldering, cleaning, quality testing, packaging, warehousing and the like. By adopting the cyl...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	BAO SONGJIAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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