SMT chip mounting process

The invention discloses a surface mount technology (SMT). The invention relates to the technical field of SMT patches, the method comprises the steps of screen printing, dispensing, patching, curing,reflow soldering, cleaning, quality testing, packaging, warehousing and the like. By adopting the cylindrical furnace body structure, the PCB can rotate in the furnace body under the action of the turntable and is heated and cured, the curing time can be ensured, the equipment space is obviously reduced compared with the traditional linear curing furnace, the circulating flow of internal hot air flow is realized by virtue of the flow guide mechanism, and the energy consumption is reduced. 本发明公开了一种SMT贴片工艺，涉及SMT贴片技术领域，包括丝印、点胶、贴片、固化、回流焊接、清洗、质检以及包装入库等过程，本发明采用圆柱形的炉体结构，PCB板能够在转盘的作用下在炉体内旋转并被加热固化，固化时间能够得到保证，相较于传统的直线型固化炉，显著降低了设备空间，且借助于导流机构，实现了内部热气流的循环流动，降低了能源消耗。