Thick copper circuit board high-precision solder mask overprinting equipment and process thereof

The invention relates to high-precision solder mask overprinting equipment for a thick copper circuit board. The equipment comprises a screen printer body, wherein a printing table, a screen printingmechanism and a scraper mechanism matched with the screen printing mechanism are arranged on the screen printer body. The printing table is located below the screen printing mechanism. The scraper blade mechanism is positioned above the screen printing mechanism; the scraper mechanism comprises a mounting plate arranged on the screen printer body, a telescopic air cylinder arranged on the mountingplate, a scraper arranged on the side, close to the screen printing mechanism, of a telescopic shaft of the telescopic air cylinder, and an adjusting part arranged on the telescopic shaft and used for adjusting the scraper. A containing groove is formed in the side face, close to the screen printing mechanism, of the scraper, a pressing column is slidably arranged in the containing groove, a rubber layer covering the cont