Manufacturing method of printed circuit board with electromagnetic wave shielding film

The present invention provides a manufacturing method of A printed circuit board with AN electromagnetic wave shielding film that can produce a printed circuit board with a electromagnetic wave shielding film having a conductive adhesive layer with excellent flame retardancy, and in which the adhesive component is not easily eluted from the conductive adhesive layer when thermally pressing a printed wiring board with an insulating film and an electromagnetic wave shielding film. The thickness of the conductive adhesive layer (anisotropic conductive adhesive layer 24) is 0.5 [mu]m or more and 30 [mu]m or less. The adhesive component of the conductive adhesive layer contains adhesive resin and flame retardant, The content of the flame retardant in the adhesive component is 1 part by mass ormore and 1,000 parts by mass or less relative to 100 parts by mass of the adhesive resin, the flame retardant has a melting point of 25 DEG C or more at 1 atmosphere, and The temperature T of the hotpressing and the melting p