LEADFRAME WITH A METAL OXIDE COATING AND METHOD OF FORMING THE SAME

The disclosure relates to a leadframe with a metal oxide coating and a method of forming the same. A leadframe including a metal oxide layer on at least a portion of the leadframe are disclosed. Morespecifically, leadframes with a metal layer and a metal oxide layer formed on one or more leads before a tin finish plating layer is formed are described. The layers of metal and metal oxide between the one or more leads and the tin finish plating layer reduce the formation of tin whiskers, thus reducing the likelihood of shorting and improving the overall reliability of the package structure anddevice produced. 本公开涉及具有金属氧化物涂层的引线框架及其形成方法。公开了一种包括在引线框架的至少部分上的金属氧化层的引线框架。更特别地，描述了在锡电镀层被形成之前具有在一个或多个引线上形成金属层和金属氧化物层的引线框架。在一个或多个引线与锡电镀层之间的金属层和金属氧化物层减少了锡晶须的形成，因此减少了短路的可能性，并且改善了封装结构和被生产的器件的总体可靠性。