Electronic device package structure and method for fabricating the same

An electronic device package structure and a manufacturing method thereof are provided. The electronic device package structure includes a first electronic device layer, a second electronic device layer, and a filling layer disposed between the first electronic device layer and the second electronic device layer, wherein the Young's modulus of the second electronic device layer is less than or equal to the Young's modulus of the first electronic device layer, and the Young's modulus of the filling layer is less than the Young's modulus of the second electronic device layer, and the ratio of the Young's modulus of the first electronic device layer to the Young's modulus of the filling layer is 10 to 1900 and the ratio of the Young's modulus of the second electronic device layer to the Young's modulus of the filling layer is 7.6 to 1300. 本揭露公开一种电子元件封装结构及其制造方法。电子元件封装结构包含第一电子元件层、第二电子元件层以及设置于第一电子元件层与第二电子元件层之间的填充层，其中第二电子元件层的杨氏系数小于或等于第一电子元件层的杨氏系数，且填充层的杨氏系数小于第二电子元件层的杨氏系数，第一电子元件层与填充层的杨氏系数比值为10～1900，第二电子元件层与填充层的杨氏系数比值为