METHOD FOR TRANSFERRING LIGHT-EMITTING STRUCTURES

The invention relates to a method for transferring light-emitting structures (100) on one side, referred to as the receiving side (400a), of a receiving substrate (400). The receiving side is furtherprovided with interconnection means (510) intended for individually addressing each of the structures...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: VOLPERT MARION, BEIX VINCENT, LEVY FRANCOIS, DE MORO FABRICE, IBRAHIM MARIO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to a method for transferring light-emitting structures (100) on one side, referred to as the receiving side (400a), of a receiving substrate (400). The receiving side is furtherprovided with interconnection means (510) intended for individually addressing each of the structures. The light-emitting structures are initially formed on a support substrate and are separated by paths. It is thus proposed in the present invention that reflective walls be formed, in alignment with the paths, which comprise a support polymer (the second polymer) supporting on the flanks thereof ametal film. Such an arrangement of reflective walls makes it possible to reduce the stresses exerted on the light-emitting structures during the transfer method according to the present invention. Moreover, the reflective walls, according to the present invention, can be formed on all of the light-emitting structures which rest on a support substrate. 本发明涉及一种用于将发光结构(100)转移到容纳基板(400)的被称为接纳侧(400a)的一侧上的方法。接纳侧进一步设置有互连构件(510),