METHOD FOR TRANSFERRING LIGHT-EMITTING STRUCTURES
The invention relates to a method for transferring light-emitting structures (100) on one side, referred to as the receiving side (400a), of a receiving substrate (400). The receiving side is furtherprovided with interconnection means (510) intended for individually addressing each of the structures...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a method for transferring light-emitting structures (100) on one side, referred to as the receiving side (400a), of a receiving substrate (400). The receiving side is furtherprovided with interconnection means (510) intended for individually addressing each of the structures. The light-emitting structures are initially formed on a support substrate and are separated by paths. It is thus proposed in the present invention that reflective walls be formed, in alignment with the paths, which comprise a support polymer (the second polymer) supporting on the flanks thereof ametal film. Such an arrangement of reflective walls makes it possible to reduce the stresses exerted on the light-emitting structures during the transfer method according to the present invention. Moreover, the reflective walls, according to the present invention, can be formed on all of the light-emitting structures which rest on a support substrate.
本发明涉及一种用于将发光结构(100)转移到容纳基板(400)的被称为接纳侧(400a)的一侧上的方法。接纳侧进一步设置有互连构件(510), |
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