ELECTROLYTIC SN OR SN ALLOY PLATING SOLUTION AND METHOD FOR PRODUCING ELECTROLYTIC SN OR SN ALLOY PLATED ARTICLE

The purpose of the present invention is to provide an Sn or Sn alloy plating solution which is able to have a lower Pb concentration. An electrolytic Sn or Sn alloy plating solution for forming a plated article that is subjected to solder bonding. This electrolytic Sn or Sn alloy plating solution is...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ENOMOTO MASATO, KANO TOSHIKAZU, TSUJIMOTO MASANOBU, KISO MASAYUKI, OKADA AKIRA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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