ELECTROLYTIC SN OR SN ALLOY PLATING SOLUTION AND METHOD FOR PRODUCING ELECTROLYTIC SN OR SN ALLOY PLATED ARTICLE

The purpose of the present invention is to provide an Sn or Sn alloy plating solution which is able to have a lower Pb concentration. An electrolytic Sn or Sn alloy plating solution for forming a plated article that is subjected to solder bonding. This electrolytic Sn or Sn alloy plating solution is characterized by containing at least a sulfur-based compound, an Sn salt, one or more acids or water-soluble salts thereof selected from among inorganic acids, organic acids and water-soluble salts thereof, and a surfactant. This electrolytic Sn or Sn alloy plating solution is also characterized inthat the sulfur-based compound is a thiol compound (formula A) represented by general formula AA, a salt of the thiol compound (formula A) or a disulfide compound (formula B). 本发明的目的是提供一种能够降低Pb浓度的Sn或Sn合金镀液。一种Sn或Sn合金电镀液，其特征在于，所述Sn或Sn合金电镀液用于形成供于焊接的镀覆物，其至少含有硫系化合物、Sn盐、选自无机酸、有机酸或其水溶性盐中的1种以上的酸或其水溶性盐、以及表面活性剂，所述硫系化合物为下述通式所示的硫醇化合物(式A)、硫醇化合物(式A)的盐、或二硫化物(式B)。