Hybrid lead wire frame for semiconductor pipe core package with improved creepage distance

The embodiments of the invention provide a packaged semiconductor device and a lead wire frame for the device, such as a lead wire frame. The lead wire frame comprises: a row of lead wire fingers, wherein the outer end of each lead wire finger is connected to the leaded wire side of the lead wire frame; a package main body perimeter indicating the arrangement of the package main body of the packaged semiconductor device, wherein the inner end of each lead wire finger falls within the package main body perimeter; a retention tab extending from the inner edge of the lead-wire-free side of the lead wire frame, wherein the retention tab falls outside the package main body perimeter; and a non-conductive connection strip structure attached to the retention tab, wherein the non-conductive connection strip structure falls within the package main body perimeter. 本发明提供封装半导体装置和用于此类装置的引线框架的实施例，例如一种引线框架，该引线框架包括：一行引线指，其中每个引线指的外端连接到所述引线框架的有引线侧；封装主体周界，所述封装主体周界指示所述封装半导体装置的封装主体的布置，其中每个引线指的内端落入所述封装主体周界内；固位突片，所述固位突片从所述引线框架的无引线侧