Chip cutting device and operation method thereof

The invention provides a chip cutting device and an operation method thereof, and relates to the field of industrial production. The chip cutting device is used for cutting solar chips and comprises abase table, a raw material case, a feeding mechanical arm, a conveying assembly, a cutting assembly...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LU YUZHAO, GU HONGYANG, CHENG XIAOLONG, WEI XIAOFENG, YANG ZHIMING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a chip cutting device and an operation method thereof, and relates to the field of industrial production. The chip cutting device is used for cutting solar chips and comprises abase table, a raw material case, a feeding mechanical arm, a conveying assembly, a cutting assembly and a visual locating assembly, wherein the raw material case, the feeding mechanical arm, the conveying assembly, the cutting assembly and the visual locating assembly are arranged on the base table. The raw material case is used for bearing solar chips. The feeding mechanical arm is used for grabbing the solar chips in the raw material case to the conveying assembly. The conveying assembly is used for conveying the solar chips to the cutting assembly. The visual locating assembly is used forlocating wires in the solar chips. The cutting assembly is used for cutting the solar chips. By means of the chip cutting device, the visual locating assembly is used for locating the wires in the solar chips, the cutting posi