LIGHT-FIXABLE AND HEAT-CURING COMPOUNDS BASED ON EPOXY RESINS AND THIOLS
The invention relates to a single-component compound, which is liquid at room temperature and which can be fixed by radiation and cured by heat, and comprises the following components: (A) at least one difunctional compound containing epoxy; (B) at least difunctional thiol; (C) a radiation-curable c...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a single-component compound, which is liquid at room temperature and which can be fixed by radiation and cured by heat, and comprises the following components: (A) at least one difunctional compound containing epoxy; (B) at least difunctional thiol; (C) a radiation-curable compound; (D) a photoinitiator; (E) a stabilizer mixture, which contains at least one sulfonyl isocyanate and at least one acid; and (F) a nitrogen compound as an accelerator. The compounds can be worked at room temperature over a period of at least 24 hours and can be fully cured at low temperatures.
本发明涉及一种在室温下为液体、能够通过辐射固定并通过热固化的组合物,所述组合物包含以下组分:(A)至少双官能的含环氧化合物;(B)至少双官能的硫醇;(C)辐射固化性化合物;(D)光引发剂;(E)稳定剂共混物,包含至少一种磺酰基异氰酸酯和至少一种酸;(F)作为促进剂的氮化合物。所述组合物在室温下在至少24小时的时间段内可加工,并且能够甚至在低温下完全固化。 |
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