Electronic package element and manufacturing method thereof

The invention discloses an electronic package element and a manufacturing method thereof. The method comprises the steps: forming an insulating layer and a circuit layer on an electronic element; forming a dielectric layer on the insulating layer to coat the circuit layer and expose a part of the surface of the circuit layer; forming a metal bump on the surface, exposed out of the dielectric layer, of the circuit layer; forming an encapsulation layer coating the metal bump on the dielectric layer; using the packaging layer as an outermost layer insulation structure of the electronic package element; removing a part of the metal bump and a part of the packaging layer; enabling the metal bump to form a metal body, then forming a conductive element on the top surface of the metal body, and enabling the encapsulation layer not wrapping the conductive element so as to fill the gap between two adjacent lines in the circuit layer fully through the dielectric layer. And requirements of fine line width and fine line d