High-reliability image sensor wafer-level fan-out packaging structure and method

The invention provides a high-reliability image sensor wafer-level fan-out packaging structure and method. The high-reliability image sensor wafer-level fan-out packaging structure comprises a substrate, a CIS chip, and solder balls. A photosensitive area of the CIS chip is arranged facing one surfa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG JIAO, SONG KUNSHU, MA SHUYING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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