Gold bonding wire reliability evaluation method

The invention discloses a gold bonding wire reliability evaluation method. Four groups of samples are provided, one group is subjected to a bonding strength test; the rest three groups are subjected to temperature cycle accelerated life test and then subjected to a bonding strength test, so sensitiv...

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Bibliographische Detailangaben
Hauptverfasser:	TAN XIAOHONG, XING ZONGFENG, QIN GUOLIN, LI XIAOHONG, CHEN XIANGYU, YANG QIAN, ZHU CHAOXUAN, YAN ZIPENG, LUO JUN, YANG YONG, LIN ZHEN, WU ZHAOXI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
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Beschreibung
Zusammenfassung:	The invention discloses a gold bonding wire reliability evaluation method. Four groups of samples are provided, one group is subjected to a bonding strength test; the rest three groups are subjected to temperature cycle accelerated life test and then subjected to a bonding strength test, so sensitive parameters of the three groups of devices are obtained; fitting is performed on each group of sensitive parameters by utilizing a degradation track model; a degradation track model of each group of devices is obtained; then the pseudo life of each device is extrapolated; the pseudo life of each device is analyzed by using a life distribution graphical representation method; therefore, a life distribution function of the test device under the accelerated stress test is obtained; the average life of the device is calculated by using a life distribution function; the average life is substituted into a temperature cycle stress acceleration model to obtain model parameters; acceleration factorscan be calculated by uti