Exhaust module, wafer processing system and method for exhausting waste gas
The present disclosure provides an exhaust module for exhausting waste gas from at least one wafer baking apparatus having an exhaust port. The exhaust module includes at least one pipeline, a heatingunit, a solvent dispensing unit, and a filtering unit. The at least one pipeline is connected to the...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present disclosure provides an exhaust module for exhausting waste gas from at least one wafer baking apparatus having an exhaust port. The exhaust module includes at least one pipeline, a heatingunit, a solvent dispensing unit, and a filtering unit. The at least one pipeline is connected to the exhaust port of the wafer baking apparatus and configured to exhaust the waste gas from the waferbaking apparatus. The heating unit is connected to the pipeline and configured to heat the exhaust gas. The solvent dispensing unit is connected to the heating unit and configured to dispense a solvent to cool and dissolve the waste gas. The filtering unit is connected to the solvent dispensing unit and configured to filter the solvent. The invention also provides a wafer processing system and a method for exhausting waste gas.
本公开提供了一种用于从至少一个具有排气口的晶圆烘烤装置排放废气的排气模块。排气模块包括至少一个管道、加热单元、溶剂分配单元和过滤单元。至少一个管道连接至晶圆烘烤装置的排气口,并且配置成从晶圆烘烤装置排放废气。加热单元连接至管道,并且配置成加热废气。溶剂分配单元连接至加热单元,并且配置成分配溶剂以冷却并溶解废气。过滤单元连接至溶剂分配单元,并且配置成过滤溶剂。本发明还提供一种晶圆处理系统 |
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