Lead frame with selective pattern plating

A copper-based lead frame for assembling a semiconductor device includes a plurality of lead fingers disposed about a die pad, wherein the lead fingers extend outside the die pad, and each lead fingerhas a proximal end proximate to the die pad and a distal end distal from the die pad. A metal plating layer is formed on the lead fingers, wherein the first lead finger has a metal plating layer plated at the proximal end and the second lead finger has a metal plating layer plated at the distal end. The first lead fingers and the second lead fingers are alternately arranged around the die pad layer. 一种用于装配半导体器件的铜基引线框，包括：多个布置在管芯垫层周围的引线指，所述引线指在管芯垫层外延伸，每个引线指具有接近管芯垫层的近端和远离管芯垫层的远端。金属镀层形成在引线指上，其中第一引线指具有镀在近端的金属镀层，第二引线指具有镀在远端的金属镀层。第一引线指和第二引线指交替的配置在管芯垫层周围。