Wafer trimming module and system
A wafer trimming module and system are provided. The wafer trimming module includes a holder and a polishing pad. The holder has an opening. The polishing pad is attached to a bottom and a sidewall ofthe opening. The polishing pad is compressible. 本发明提供了一种晶圆修整模块和系统。晶圆修整模块包括承载件和研磨垫，所述承载件具有开口，所述研磨垫附接到...
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| creator | LEE SUN-WUNG |
| description | A wafer trimming module and system are provided. The wafer trimming module includes a holder and a polishing pad. The holder has an opening. The polishing pad is attached to a bottom and a sidewall ofthe opening. The polishing pad is compressible.
本发明提供了一种晶圆修整模块和系统。晶圆修整模块包括承载件和研磨垫，所述承载件具有开口，所述研磨垫附接到所述开口的底部和侧壁，所述研磨垫是可压缩的。 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN111331506A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN111331506A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN111331506A3</originalsourceid><addsrcrecordid>eNrjZFAIT0xLLVIoKcrMzc3MS1fIzU8pzUlVSMxLUSiuLC5JzeVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGhsbGhqYGZo7GxKgBAFEFJSs</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wafer trimming module and system</title><source>esp@cenet</source><creator>LEE SUN-WUNG</creator><creatorcontrib>LEE SUN-WUNG</creatorcontrib><description>A wafer trimming module and system are provided. The wafer trimming module includes a holder and a polishing pad. The holder has an opening. The polishing pad is attached to a bottom and a sidewall ofthe opening. The polishing pad is compressible.
本发明提供了一种晶圆修整模块和系统。晶圆修整模块包括承载件和研磨垫，所述承载件具有开口，所述研磨垫附接到所述开口的底部和侧壁，所述研磨垫是可压缩的。</description><language>chi ; eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200626&DB=EPODOC&CC=CN&NR=111331506A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200626&DB=EPODOC&CC=CN&NR=111331506A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE SUN-WUNG</creatorcontrib><title>Wafer trimming module and system</title><description>A wafer trimming module and system are provided. The wafer trimming module includes a holder and a polishing pad. The holder has an opening. The polishing pad is attached to a bottom and a sidewall ofthe opening. The polishing pad is compressible.
本发明提供了一种晶圆修整模块和系统。晶圆修整模块包括承载件和研磨垫，所述承载件具有开口，所述研磨垫附接到所述开口的底部和侧壁，所述研磨垫是可压缩的。</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAIT0xLLVIoKcrMzc3MS1fIzU8pzUlVSMxLUSiuLC5JzeVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGhsbGhqYGZo7GxKgBAFEFJSs</recordid><startdate>20200626</startdate><enddate>20200626</enddate><creator>LEE SUN-WUNG</creator><scope>EVB</scope></search><sort><creationdate>20200626</creationdate><title>Wafer trimming module and system</title><author>LEE SUN-WUNG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111331506A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE SUN-WUNG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE SUN-WUNG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer trimming module and system</title><date>2020-06-26</date><risdate>2020</risdate><abstract>A wafer trimming module and system are provided. The wafer trimming module includes a holder and a polishing pad. The holder has an opening. The polishing pad is attached to a bottom and a sidewall ofthe opening. The polishing pad is compressible.
本发明提供了一种晶圆修整模块和系统。晶圆修整模块包括承载件和研磨垫，所述承载件具有开口，所述研磨垫附接到所述开口的底部和侧壁，所述研磨垫是可压缩的。</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING |
| title | Wafer trimming module and system |
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