Wafer trimming module and system

Wafer trimming module and system

A wafer trimming module and system are provided. The wafer trimming module includes a holder and a polishing pad. The holder has an opening. The polishing pad is attached to a bottom and a sidewall ofthe opening. The polishing pad is compressible. 本发明提供了一种晶圆修整模块和系统。晶圆修整模块包括承载件和研磨垫，所述承载件具有开口，所述研磨垫附接到...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: LEE SUN-WUNG
Format: Patent
Sprache:chi ; eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Beschreibung
Zusammenfassung:A wafer trimming module and system are provided. The wafer trimming module includes a holder and a polishing pad. The holder has an opening. The polishing pad is attached to a bottom and a sidewall ofthe opening. The polishing pad is compressible. 本发明提供了一种晶圆修整模块和系统。晶圆修整模块包括承载件和研磨垫，所述承载件具有开口，所述研磨垫附接到所述开口的底部和侧壁，所述研磨垫是可压缩的。