Manufacturing process of moisture -proof circuit board

The invention discloses manufacturing process of a moisture-proof circuit board. The manufacturing process comprises the following manufacturing steps that: a whole blank circuit board passes througha cutting device; the whole blank circuit board is cut into the required size of a circuit board; sol...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIANG PENG, ZHOU YUNSHUANG, ZHU FUPENG, GAN BINGHUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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