Manufacturing process of moisture -proof circuit board

The invention discloses manufacturing process of a moisture-proof circuit board. The manufacturing process comprises the following manufacturing steps that: a whole blank circuit board passes througha cutting device; the whole blank circuit board is cut into the required size of a circuit board; solder paste is injected into the cut circuit board through a position where the cut circuit board needs to be pasted into an electric appliance component; after solder paste is injected, required electrical components are pasted through the pasting device; after mounting, a sealing sheet is mounted;the mounted circuit board is dried and cooled; the cooled circuit board is implanted into a program; the circuit board implanted with the program simulates the working condition of the circuit board by switching on a power supply; and a normal circuit board after working condition simulation is placed on the base. Epoxy is injected through the epoxy injection mechanism on the base, after the epoxyis solidified, the circuit